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SynFoam LG is a unique, expandable, closed cell syntactic foam that provides very low density and moderate strength. SynFoam LG is an ideal replacement for polyurethane foams where higher modulus is needed to support lightweight structures. SynFoam LG has low dielectric loss and loss properties at a reduced weight than traditional low loss materials used for electronic applications. The system is suitable for electronic potting and encapsulation as well as structural support. SynFoam LG is ideal for electronic applications that require room temperature curing temperatures and will not be exposed to high continuous use temperatures. Please see our ELG grade foams for high temperature applications.

SynFoam LG is available as one and five gallon kits. Each kit contains an A and B side that must be mixed together prior to casting. Cure is achieved within 24 hours and full properties will be realized after 7 days at room temperature. Densities can be customized to the user's specifications. Interlayer adhesion allowing large structures to be made with multiple pours.

If you have a specific mold for use with SynFoam LG we also provide final casting and fabrication services.

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Standard Properties

Grade Density,
Compressive Strength,
Flex Strength,
Dielectric Constant
Dissipation Factor
Tg, oF
LG-15 15 1,000 900 1.61 0.009 150
LG-25 25 2,300 2,100 1.82 0.015 150
LG-35 35 5,200 5,100 2.05 0.018 150
For More Information please contact us by phone at (973)994-4334 or by e-mail at to further discuss your application.